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2023

  1. AI computing reaches for the edge - Subramanian S. Iyer and Vwani Roychowdhury 
  2. T. Fukushima, T. Xiang, H. Ranjan, N. Tripathi, C. Liu, G. Ouyang, R. Irwin, and S.S. Iyer, "Advanced Packaging Methods Used for Energy Storage from Intermittent Renewable Sources," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 444-449, doi: 10.1109/ECTC51909.2023.00080. 
  3. H. Ren, K. Sahoo, T. Xiang, G. Ouyang, and S. S. Iyer, “Demonstration of a Power-efficient and Cost-effective Power Delivery Architecture for Heterogeneously Integrated Wafer-scale Systems,” in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), May 2023, pp. 1614–1621. doi: 10.1109/ECTC51909.2023.00274. 
  4. G. Ouyang, T. Fukushima, H. Ren and S. S. Iyer, "3D flexible Fan-Out Wafer-Level Packaging for Wearable Devices," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 601-605, doi: 10.1109/ECTC51909.2023.00106. 
  5. K. Sahoo, H. Ren and S. S. Iyer, "A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 362-366, doi: 10.1109/ECTC51909.2023.00067. 
  6. A. Kuchhangi, H. Ren, K. Sahoo, and S. S. Iyer, “Large Wafer GaN on Silicon Reconstitution with Gold-to-Gold Thermocompression Bonding,” in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), May 2023, pp. 1633–1637. doi: 10.1109/ECTC51909.2023.00277. 
  7. Sepideh Nouri and Subramanian S. Iyer, "An 8T eNVSRAM Macro in 22nm FDSOI Standard Logic with Simultaneous Full-Array Data Restore for Secure IoT Devices," 2022 IEEE International Solid- State Circuits Conference (ISSCC). 
  8. S. Qiao, S. Moran, D. Srinivas, S. Pamarti and S. S. Iyer, "Demonstration of Analog Compute-In-Memory Using the Charge-Trap Transistor in 22 FDX Technology," 2022 International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 2022, pp. 2.5.1-2.5.4, doi: 10.1109/IEDM45625.2022.10019527. 

     

     

2022

  1. S. S. Nagi, U. Rathore, K. Sahoo, T. Ling, S. S. Iyer and D. Marković, "A 16-nm 784-Core Digital Signal Processor Array, Assembled as a 2 x 2 Dielet With 10 um Pitch Interdielet I/O for Runtime Multiprogram Reconfiguration," in IEEE Journal of Solid-State Circuits, 2022, doi: 10.1109/JSSC.2022.3212685. 
  2. K. T. Kannan, B. Vaisband, K. Sahoo and S. S. Iyer, "An On-Chip ESD Sensor for Use in Advanced Packaging," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 7, pp. 1051-1062, July 2022, doi: 10.1109/TCPMT.2022.3177663. 
  3. U. Rathore, S. S. Nagi, S. Iyer and D. Marković, "A 16nm 785GMACs/J 784-Core Digital Signal Processor Array With a Multilayer Switch Box Interconnect, Assembled as a 2×2 Dielet with 10μm-Pitch Inter-Dielet I/O for Runtime Multi-Program Reconfiguration," 2022 IEEE International Solid- State Circuits Conference (ISSCC), 2022, pp. 52-54, doi: 10.1109/ISSCC42614.2022.9731582. 
  4. Yu-Tao Yang, Haoxiang Ren, Su Kong Chong, Gang Qiu, Shu-Yun Ku, Yang Cheng, Chaowei Hu, Tiema Qian, Kuan-Neng Chen, Ni Ni, Kang L. Wang, and Subramanian 3 S. Iyer, “RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for future large-scale quantum applications,” 72rd IEEE Electronic Components and Technology Conference (ECTC), San Diego, USA, May 2022, pp. 949-955. 
  5. G. Ouyang, E. MacInnis, H. Sun, G. Whang, H. Ren, R. Irwin, B. Dunn, S. S. Iyer, "Fabrication of Flexible Li-ion Battery Electrodes Using “Battlets” Approach with Ionic Liquid Electrolyte for Powering Wearable Devices," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022. 
  6. H. Ren, S. Pal, G. Ouyang, R. Irwin, Y.-T. Yang, S. S. Iyer, "TSV-less Power Delivery for Wafer-scale Assemblies and Interposers," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022. 
  7. H. Ren, Y.-T. Yang, S. S. Iyer, "Recess Effect Study and Process Optimization of Sub-10 μm Pitch Die-to-wafer Hybrid Bonding," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022. 
  8. H. Sun, G. Ezhilarasu, G. Ouyang, R. Irwin, S. S. Iyer, "A Heterogeneously Integrated and Flexible Inorganic Micro-display on FlexTrateTM using Fan-Out Wafer-Level Packaging," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022. 
  9. P. Venkatesh, R. Irwin, A. Alam, M. Molter, A. Kapoor, B. Gaonkar, L. Macyszyn, M. Selvan Joseph, S. S. Iyer, "Smartphone App-Enabled Flex sEMG Patch using FOWLP," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022. 
  10. K. Sahoo, U. Rathore, S. Chandra Jangam, T. Nguyen, D. Markovic, S. S. Iyer, "Functional Demonstration of < 0.4-pJ/bit, 9.8 μm Fine-Pitch Dielet-to-Dielet Links for Advanced Packaging using Silicon Interconnect Fabric," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022. 
  11. R. Irwin, S. S. Iyer, "Characterization and Design Improvement of a High Bandwidth, High Frequency Flexible Connector for Signal Delivery," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022. 
  12. G. Sabbir, S. S. Iyer, "Ultra-High Conductivity Interconnects for 77K CMOS Using Heterogeneous Integration," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022. 
  13. Yu-Tao Yang, Haoxiang Ren ,Chaowei Hu, Peng Zhang, Ni Ni, Kang L. Wang, and Subramanian S. Iyer, “Fine-Pitch (≤10 μm) Nb-based Superconducting Silicon Interconnect Fabric for Large-Scale Quantum System Application,” Center for Design -Enabled Nanofabrication Berkeley UCLA UCSD (C-DEN) Workshop Integration, Fremont, USA, May 2022. 
  14. Yu-Tao Yang, Haoxiang Ren,Chaowei Hu, Peng Zhang, Ni Ni, Kang L. Wang, and Subramanian S. Iyer, “Emerging Applications Using Niobium-based Superconducting Silicon Interconnect Fabric,” 7th Annual Critical Material Conference (CMC), Arizona, Apr. 2022. 
  15. Zhe Wan, T. Wang, Y. Zhou, S. S Iyer, and V. Roychowdhury, "Accuracy and Resiliency of Analog Compute-in-Memory Inference Engines," ACM Journal on Emerging Technologies in Computing Systems (JETC), vol. 18, no. 2, pp. 1-23, April 2022. 

 

2021

  1. Y.-T. Yang, C. Hu, P. Zhang, H. Ren, N. Ni, K. L. Wang, and S. S. Iyer, "Fine-Pitch (≤10 μm) Nb-based Superconducting Silicon Interconnect Fabric for Large-Scale Quantum System Application," IEEE International Electron Devices Meeting (IEDM), San Francisco, Dec. 2021, pp. 873-876. 
  2. K. Sahoo, B. Vinnakota, S. Ardalan and S. S. Iyer, "Co-optimizing signaling protocol with semiconductor and packaging technology," 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609161. 
  3. G. Ouyang, G. Ezhilarasu, H. Sun, H. Ren, Y. -T. Yang and S. S. Iyer, "A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 2266-2271, doi: 10.1109/ECTC32696.2021.00355. 
  4. U. Shah, S. S. Iyer and T. S. Fisher, "Segmented Thermal Management with Flash Cooling for Heterogeneous Wafer-Scale Systems," 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, pp. 589-594, doi: 10.1109/ITherm51669.2021.9503210. 
  5. Y.-T. Yang, C. Hu, P. Zhang, N. Shakoorzadeh, H. Ren, N. Ni, K. Wang, and S. S. Iyer, "Nb-Based Superconducting Silicon Interconnect Fabric for Cryogenic Computing Applications," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1577-1582, doi: 10.1109/ECTC32696.2021.00250. 
  6. A. Alam, M. Molter, A. Kapoor, B. Gaonkar, S. Benedict, L. Macyszyn, M. S. Joseph, and S. S. Iyer, "Flexible heterogeneously integrated low form factor wireless multi-channel surface electromyography (sEMG) device," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1544-1549, doi: 10.1109/ECTC32696.2021.00245. 
  7. N. S. Chase, R. Irwin, Y. T. Yang, H. Ren and S. S. Iyer, "Reliability Considerations for Wafer Scale Systems," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 84-89, doi: 10.1109/ECTC32696.2021.00025. 
  8. K. T. Kannan and S. S. Iyer, "Novel high-power delivery architecture for heterogeneous Integration systems," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 164-169, doi: 10.1109/ECTC32696.2021.00037. 
  9. S. Pal, K. Sahoo, I. Alam, H. Suhail, R. Kumar, S. Pamarti, P. Gupta, and S. S. Iyer, "I/O Architecture, Substrate Design, and Bonding Process for a Heterogeneous Dielet-Assembly based Waferscale Processor," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 298-303, doi: 10.1109/ECTC32696.2021.00057. 
  10. G. Ouyang, G. Whang, E. MacInnis and S. S. Iyer, "Fabrication of Flexible Ionic-Liquid Thin Film Battery Matrix on FlexTrate™ for Powering Wearable Devices," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1620-1626, doi: 10.1109/ECTC32696.2021.00257. 
  11. K. Sahoo, S. Pal, N. Shakoorzadeh, Y. -T. Yang and S. S. Iyer, "Copper to gold thermal compression bonding in heterogenous wafer-scale systems," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 487-493, doi: 10.1109/ECTC32696.2021.00088. 
  12. R. Irwin, K. Sahoo, S. Pal and S. S. Iyer, "Flexible Connectors and PCB Segmentation for Signaling and Power Delivery in Wafer-Scale Systems," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 507-513, doi: 10.1109/ECTC32696.2021.00091. 
  13. H. Ren, Y.-T. Yang, G. Ouyang, and S. S. Iyer, "Mechanism and Process Window Study for Die-to-Wafer (D2W) Hybrid Bonding," in ECS Journal of Solid State Science and Technology, vol. 10, no. 6, 2021. https://doi.org/10.1149/2162-8777/ac0a52 
  14. U. Shah, M. Ma, M. T. Barako, A. Bar-Cohen, S. S. Iyer and T. S. Fisher, "Experimental Demonstration of Pressure-Driven Flash Boiling for Transient Two-Phase Cooling," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 10, pp. 1604-1614, Oct. 2021, doi: 10.1109/TCPMT.2021.3085876. 
  15. S. Pal, J. Liu, I. Alam, N. Cebry, H. Suhail, S. Bu, S. S. Iyer, S. Pamarti, R. Kumar, and P. Gupta, "Designing a 2048-Chiplet, 14336-Core Waferscale Processor", in 2021 ACM/IEEE Design Automation Conference, San Francisco, CA, USA 
  16. S. C. Jangam and S. S. Iyer, "Silicon-Interconnect Fabric for Fine-pitch (≤10 μm) Heterogeneous Integration," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2021.3075219 
  17. R. Irwin, and S. S. Iyer, "Signal and Power Delivery using Flexible, High-Speed Connectors and Segmented PCBs for System-on-Wafer Applications," GOMACTech Conference, March 2021. 
  18. U. Shah, K. Kalappurakal, T. S. Fisher, and S. S. Iyer, "Segmented Power Delivery and Thermal Management for Heterogenous Wafer-scale Systems," GOMACTech Conference, March 2021. 
  19. N. Shakoorzadeh, and S. S. Iyer, "Reliability Considerations for Wafer Scale Systems," GOMACTech Conference, March 2021. 
  20. Rabiei E, Huang L, Chien H-Y et al., "Method and software platform for electronic COTS parts reliability estimation in space applications," Proceedings of the Institution of Mechanical Engineers, Part O: Journal of Risk and Reliability, March 2021. doi:10.1177/1748006X21998231 
  21. Y.-T. Yang, C. Hu, P. Zhang, N. Shakoorzadeh, N. Ni, K. L. Wang, and S. S. Iyer, "Nb-based Superconducting Silicon Interconnect Fabric for cryogenic electronics," Quantum Science and Technology, vol. 6, no. 2, pp. 1-14, 2021. DOI: http://doi.org/10.1088/2058-9565/abe279 
  22. R. M. Brewer, J. Cox, D. R. Ball, S. Moran, B. D. Sierawski, P. F. Wang, E. X. Zhang, D. M. Fleetwood, R. D. Schrimpf, S. S. Iyer, and M. L. Alles, "Total Ionizing Dose Responses of 22 nm FDSOI and 14 nm Bulk FinFET Charge-Trap Transistors," in IEEE Transactions on Nuclear Science, doi: 10.1109/TNS.2021.3059594.