Mohammad Abbas
Materials Science and Engineering
Primary Area: Physical Wave Electronics
2017 - 2018
Email: mabbas@g.ucla.edu
Career: Biosense Webster
Arsalan Alam
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2016 - 2021
Email: arsalanalam89@g.ucla.edu
Career: AMD
Pranav Ambhore
Materials Science and Engineering
Primary Area: Au-Au Bonding
2017 - 2020
Email: pranavambhore@g.ucla.edu
Career: Bipp Analystics
Adeel Bajwa
Primary Area: Microelectronics Packaging and Reliability
2015 - 2017
Email: abajwa@ucla.edu
Career: Kulicke and Soffa
Samatha Benedict
Postdoctoral Researcher
Primary Area: Heterogeneous Integration on Flexible Substrate
2019 - 2020
Email : samatha.benedict@gmail.com
Han Chien
Materials Science and Engineering
Primary Area: Humidity examination of Parylene C adhesive
2020
Email: chien.mse04@g2.nctu.edu.tw
Status: Undergradutate Student, National Chiao Tung University
Jon Cox
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2017 - 2020
Email: joncox@g.ucla.edu
Career: General Electric
Arpan Dasgupta
Electrical and Computer Engineering
Primary Area : Physical and Wave Electronics
2018 - 2020
Email: arpandg@ucla.edu
Career: GlobalFoundries
Takafumi Fukushima
Associate Professor | Tohoku University
Primary Area: Microelectronic packaging and polymeric materials
Email: takfukushima@ucla.edu
Career: Tohoku University, Japan
Xuefeng Gu
Electrical and Computer Engineering
Primary area: Advanced field-effect transistors, Neuromorphic computing
2016 - 2018
Email: xfgu@ucla.edu
Career: IBM
Amir Hanna
Primary Area: Implantable and Wearable electronics, Device physics and reliability.
2017 - 2019
Email: amirhanna@ucla.edu
Career: Keysight Technologies
Ko-Ching Hou
Materials Science and Engineering
Primary Area: Copper Electroplating
2018 - 2020
Email: curtis804@g.ucla.edu
Career: TSMC
Siva Chandra Jangam
Electrical and Computer Engineering
Primary area: Physical and Wave Electronics, Silicon Interconnect Fabric, SuperCHIPS
2016 - 2020
Email: sivchand@ucla.edu
Career: Apple
Faraz Khan
Electrical and Computer Engineering
Primary Area: Emerging Memory Technologies, Semiconductor Device Physics, Physical and Wave Electronics.
2016 - 2020
email: farazkhan@ucla.edu, farazkhan@engineering.ucla.edu
Career: Western Digital
Premsagar Kittur
Electrical and Computer Engineering
Primary area: Circuits & Embedded Systems
2016 - 2019
Email: premsagar@g.ucla.edu
Career: Texas Instruments
Kannan K. T.
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2016 - 2021
Email: kannankt@g.ucla.edu
Career: Infineon
Yongxi Li
Electrical and Computer Engineering
Primary Area: Neuromorphic computing and 3D Integration
2019 - 2021
Email: liyongxicool777@g.ucla.edu
Career: TSMC
Menglu Li
Materials Science and Engineering
Primary Area: Reliability of TSV, microbumps, and RDL in the 3D IC technology
2015 - 2016
Email: lucy2732@ucla.edu
Career: Apple
Ping-Yu Liu
Chemistry and Materials Science
Primary area: Cu-Cu and Au-Au wafer bonding
2016
Email: evangeline12921@gmail.com
Career: Ricoh Printing Systems America
Meng-Hsiang (Andy) Liu
Materials Science and Engineering
Primary Area: Through wafer (silicon) via and silicon interconnect fabric
2018 - 2019
Email: mhliu@ucla.edu
Career: Marvell
Yandong Luo
Electrical Engineering
Primary area: Physical and Wave Electronics
2016 - 2018
Email: yandongluo@ucla.edu
Status: PhD Candidate, Georgia Institute of Technology
Niteesh Marathe
Materials Science & Engineering
Primary Area: Electronic Materials, Direct Wafer Bonding of Cu or Au deposited on Si
2016 - 2017
Email: namarathe@g.ucla.edu
Career: Western Digital
Umesh Mogera
Primary Area: Heterogeneous Integration, PowerTherm
2018 - 2020
Email: umeshm@ucla.edu
Status: Postdoc at Texas A&M
Michael Molter
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2018 - Present
Email: michael.molter3@gmail.com
Status: MS / PhD Student, University of Illinois at Urbana-Champaign
Ashvin Nagarajan
Material Science and Engineering
Primary Area: Embedded Systems and Hardware Engineering
2019 - 2020
Email: anagarajan25@ucla.edu
Partia Naghibi
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2017 - 2018
Email: Partia@ucla.edu
Career: HRL Laboratories
Niloofar Shakoorzadeh
Materials Science and Engineering
Primary area: Characterization of Electronic Materials
2017 - 2021
Email: nellysh@ucla.edu
Career: Marvell-Inphi
Po-Chang (Steve) Shih
Materials Science and Engineering
Primary Area: Silicon interconnect fabric (Si-IF), Flextrate Connector
2018 - 2020
Email: pochang.shih@ucla.edu
Career: TSMC
Eric Sorensen
Electrical and Computer Engineering
Primary Area: Physical Wave Electronics
2018 - 2019
Email: esorensen@g.ucla.edu
Career: Keysight
Boris Vaisband
Primary Area: Heterogeneous System Integration, Power Delivery, Interconnect
2017 - 2019
Email: vaisband@ucla.edu
Career: Faculty, McGill University
Arshiya Vohra
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2018 - 2019
Email: avohra@g.ucla.edu
Career: GlobalFoundries
Zhe (Frank) Wan
Electrical and Computer Engineering
Primary Area: Neuromorphic computing and 3D Integration
2015 - 2020
Email: z.wan@ucla.edu
Career: Fortemedia
Yaodong Wang
Materials Science and Engineering
Primary Area: Pb-Free Microbump to Enable 3D Integration
2015 - 2016
Email: yaodong.wang1@gmail.com
Career: Apple
William Whitehead
Electrical Engineering
Primary Area: Neuromorphic computing
2016 - 2018
Email: williamow@g.ucla.edu
Status: Undergraduate Student, UCLA
Aidan Wolk
Computer Science & Engineering
Primary Area: Neuromorphic computing
2017 - 2020
Email: aidanwolk@g.ucla.edu
Career: Stripe
Jason Woo
Professor
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
Email: woo@ee.ucla.edu
Research Lab: CMOS Research Laboratory