Mohammad Abbas
Materials Science and Engineering
Primary Area: Physical Wave Electronics
2017 - 2018
Email: mabbas@g.ucla.edu
Career: Biosense Webster
Arsalan Alam
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2016 - 2021
Email: arsalanalam89@g.ucla.edu
Career: AMD
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Pranav Ambhore
Materials Science and Engineering
Primary Area: Au-Au Bonding
2017 - 2020
Email: pranavambhore@g.ucla.edu
Career: Bipp Analystics
Adeel Bajwa
Primary Area: Microelectronics Packaging and Reliability
2015 - 2017
Email: abajwa@ucla.edu
Career: Kulicke and Soffa
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Seungwoo Baek
MS, Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2023 - 2025
Email: seungwoo100@g.ucla.edu
LinkedIn Profile: https://www.linkedin.com/in/seungwoo-baek/
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Samatha Benedict
Postdoctoral Researcher
Primary Area: Heterogeneous Integration on Flexible Substrate
2019 - 2020
Email : samatha.benedict@gmail.com
Joseph Camyre
Computer Science
Primary Area: Software Systems
2021 - Present
Email: jcamyre127@g.ucla.edu
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Zoe Chen
Electrical and Computer Engineering
Primary Research Interests: Undecided
2022 - 2025
Email: ayya0531@g.ucla.edu
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Thomas Chu
Electrical and Computer Engineering Department
Primary Area: Integrated Circuits
2023 - Present
Email: thomas11950@g.ucla.edu
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Fred Chu
Electrical and Computer Engineering
Primary Area: FPGAs, Computer Architecture
2019 - Present
Email: freddychu@g.ucla.edu
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Jon Cox
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2017 - 2020
Email: joncox@g.ucla.edu
Career: General Electric
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Arpan Dasgupta
Electrical and Computer Engineering
Primary Area : Physical and Wave Electronics
2018 - 2020
Email: arpandg@ucla.edu
Career: GlobalFoundries
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Dr. Goutham Ezhilarasu
Deputy Director, UCLA CHIPS (2024-2025)
Dept: Electrical and Computer Engineering (Physical and Wave Electronics)
Primary Area: Advanced packaging, 3D Heterogeneous Integration (3DHI)
About: Dr. Ezhilarasu worked as an R&D engineer and served as the Deputy Director of UCLA CHIPS from 2024-2025. His independent research focused on Advanced Packaging and 3DHI, specifically in optimizing direct Cu-Cu TCB for fine bump-pitch (< 10 micron), multi-tier 3D stacking of chiplets for HPC applications and backside power delivery to wafer-scale systems.
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Takafumi Fukushima
Associate Professor | Tohoku University
Primary Area: Microelectronic packaging and polymeric materials
Email: takfukushima@ucla.edu
Career: Tohoku University, Japan
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Bilwaj Gaonkar
Postdoctoral Researcher | Neurosurgery
Primary Area: Biomedical Image Analysis and Machine Learning
Email: bgaonkar@mednet.ucla.edu
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Pranshu Garg
Electrical and Computer Engineering
Primary Area: Analog Design
2019 - 2021
Email: pranshug@g.ucla.edu
Career: NVIDIA
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Xuefeng Gu
Electrical and Computer Engineering
Primary area: Advanced field-effect transistors, Neuromorphic computing
2016 - 2018
Email: xfgu@ucla.edu
Career: Amazon
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Abhik Gude
Electrical and Computer Engineering
Primary Area: Circuits and Embedded Systems
2021 - 2023
Career: Ventana Micro Systems · Internship
Email: abhikgude@g.ucla.edu
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Amir Hanna
Primary Area: Implantable and Wearable electronics, Device physics and reliability.
2017 - 2019
Email: amirhanna@ucla.edu
Career: Keysight Technologies
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Ko-Ching Hou
Materials Science and Engineering
Primary Area: Copper Electroplating
2018 - 2020
Email: curtis804@g.ucla.edu
Career: TSMC
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Yu-Pei (Anne) Huang
Materials Science and Engineering
Primary Area: Thermocompression Bonding
2021 - 2022
Email: sssg3@g.ucla.edu
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Siva Chandra Jangam
Electrical and Computer Engineering
Primary area: Physical and Wave Electronics, Silicon Interconnect Fabric, SuperCHIPS
2016 - 2020
Email: sivchand@ucla.edu
Career: Apple
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Faraz Khan
Electrical and Computer Engineering
Primary Area: Emerging Memory Technologies, Semiconductor Device Physics, Physical and Wave Electronics.
2016 - 2020
email: farazkhan@ucla.edu
Career: Western Digital
Anthony Kim
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2021 - 2022
Email: akim58@g.ucla.edu
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Premsagar Kittur
Electrical and Computer Engineering
Primary area: Circuits & Embedded Systems
2016 - 2019
Email: premsagar@g.ucla.edu
Career: Texas Instruments
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Tanmay Konnur
MS, Materials Science and Engineering
Primary Area: Flip-chip bonding for flexible electronics applications
2023 - 2025
Email: tanmaykonnur@g.ucla.edu
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Dominic Konrad
Electrical & Computer Engineering
Primary Area: Circuits & Embedded Systems (CES)
2021 - 2023
Email: djkonrad@g.ucla.edu
Career: iRobot
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Kannan K. T.
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2016 - 2021
Email: kannankt@g.ucla.edu
Career: Infineon
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Shelly Ku
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2021 - 2021
Email: shellyku@g.ucla.edu
Status: MS Student, National Chiao Tung University
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Ankit Kuchhangi
Materials Science and Engineering
Primary Area: Fusion Bonding
2020 - Present
Email: akuchhangi3@ucla.edu
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Menglu Li
Materials Science and Engineering
Primary Area: Reliability of TSV, microbumps, and RDL in the 3D IC technology
2015 - 2016
Email: lucy2732@ucla.edu
Career: Apple
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Yongxi Li
Electrical and Computer Engineering
Primary Area: Neuromorphic computing and 3D Integration
2019 - 2021
Email: liyongxicool777@g.ucla.edu
Career: Intel
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Meng-Hsiang (Andy) Liu
Materials Science and Engineering
Primary Area: Through wafer (silicon) via and silicon interconnect fabric
2018 - 2019
Email: menghsiangliu@google.com
Career: Google
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Ping-Yu Liu
Chemistry and Materials Science
Primary area: Cu-Cu and Au-Au wafer bonding
2016
Email: evangeline12921@gmail.com
Career: Ricoh Printing Systems America
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Yandong Luo
Electrical Engineering
Primary area: Physical and Wave Electronics
2016 - 2018
Email: yandongluo@ucla.edu
Status: PhD Candidate, Georgia Institute of Technology
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Emily MacInnis
Materials Science and Engineering
Primary Area: Physical and Wave Electronics
2020 - 2022
Email: emilymacinnis@g.ucla.edu
Niteesh Marathe
Materials Science & Engineering
Primary Area: Electronic Materials, Direct Wafer Bonding of Cu or Au deposited on Si
2016 - 2017
Email: namarathe@g.ucla.edu
Career: Western Digital
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Umesh Mogera
Primary Area: Heterogeneous Integration, PowerTherm
2018 - 2020
Email: umeshm@ucla.edu
Status: Postdoc at Texas A&M
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Michael Molter
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2018 - 2021
Email: michael.molter3@gmail.com
Status: MS / PhD Student, University of Illinois at Urbana-Champaign
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Steven Moran
Electrical and Computer Engineering
Primary Area: Circuits & Embedded Systems (CES)
2016 - 2022
Career: Apple Inc
Email: steven.moran@engineering.ucla.edu
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Ashvin Nagarajan
Material Science and Engineering
Primary Area: Embedded Systems and Hardware Engineering
2019 - 2020
Email: anagarajan25@ucla.edu
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Partia Naghibi
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2017 - 2018
Email: Partia@ucla.edu
Career: HRL Laboratories
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Sepideh Nouri
Electrical and Computer Engineering
Primary Area: Circuits & Embedded Systems
2019 - 2023
Email: sepidehnouri@ucla.edu
Career: Apple, Inc.
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Guangqi Ouyang
Material Science and Engineering
Primary Area: Physical and Wave Electronics
2019 - 2024
Email: guangqiouyang@g.ucla.edu
Career: Apple Inc.
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Saptadeep Pal
Electrical and Computer Engineering
Primary Area: Circuits & Embedded Systems
2016 - 2021
Email: saptadeep@ucla.edu
Career: Stealth Mode Startup Company
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Harshit Ranjan
Materials Science and Engineering
Primary Area: Flexible Electronics
2021 - 2023
Career: Infineon Technologies
Email: harshitranjan20@g.ucla.edu
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Haoxiang Ren
Electrical and Computer Engineering
Primary Area: Power Delivery; Wafer-scale System; III-V Integration
2020 - 2025
Career: Apple
Email: haoxiang.ren@g.ucla.edu
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Krutikesh Sahoo
Electrical & Computer Engineering
Primary Area: Physical and Wave Electronics (PWE)
2019 - 2025
Career: Micron
Email: krutikesh@g.ucla.edu
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Shaurya Seth
Materials Science and Engineering
Research Area: Sn Electroplating
2022- 2023
Email: shauryaseth.app@gmail.com
Career: Analog Devices Inc.
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Ujash Shah
Mechanical and Aerospace Engineering
Primary area: Thermal Science and Engineering
Minor: MEMS/Nanotechnology
Research interest: Transient thermal management of high performance systems
2018 - 2023
Email: ujash@ucla.edu
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Niloofar Shakoorzadeh
Materials Science and Engineering
Primary area: Characterization of Electronic Materials
2017 - 2021
Email: nellysh@ucla.edu
Career: Marvell-Inphi
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Po-Chang (Steve) Shih
Materials Science and Engineering
Primary Area: Silicon interconnect fabric (Si-IF), Flextrate Connector
2018 - 2020
Email: pochang.shih@ucla.edu
Career: TSMC
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Harshal Sonagara
Materials Science and Engineering; Specialization: Semiconductor Materials
Primary Area: Optimizing performance of MicroLEDs
2022 - 2023
Email: harshalsonagara@g.ucla.edu
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Eric Sorensen
Electrical and Computer Engineering
Primary Area: Physical Wave Electronics
2018 - 2019
Email: esorensen@g.ucla.edu
Career: Keysight
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Dhruv Srinivas
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2021 - 2023
Career: Lawrence Livermore
Email: dhruvsrinivas11@gmail.com
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Niharika Tripathi
Materials Science and Engineering
Primary Area: Energy Storage and Flexible Electronics
2022 - 2023
Career: Applied Materials
Email: niharika999@g.ucla.edu
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King-Ning Tu
Professor | Electrical Engineering, City University of Hong Kong
Primary Area: Physical and Wave Electronics
Email: kntu@cityu.edu.hk
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Boris Vaisband
Affiliation: University of California, Irvine
Research interests: Heterogeneous Integration, Neuromorphic Hardware, 3-D ICs, Power Delivery, Communication
Starting Year - 2024 - Current
Email: boris.vaisband@uci.edu
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Pragathi Venkatesh
Electrical and Computer Engineering
Primary Area: Sensor Design for Non-invasive Glucose Monitoring
2020 - 2022
Email: pvenkatesh22@g.ucla.edu
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Arshiya Vohra
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2018 - 2019
Email: avohra@g.ucla.edu
Career: Marvell Semiconductor
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Zhe (Frank) Wan
Electrical and Computer Engineering
Primary Area: Neuromorphic computing and 3D Integration
2015 - 2020
Email: z.wan@ucla.edu
Career: MediaTek
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Yaodong Wang
Materials Science and Engineering
Primary Area: Pb-Free Microbump to Enable 3D Integration
2015 - 2016
Email: yaodong.wang1@gmail.com
Career: Apple
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William Whitehead
Electrical Engineering
Primary Area: Neuromorphic computing
2016 - 2018
Email: williamow@g.ucla.edu
Status: Undergraduate Student, UCLA
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Aidan Wolk
Computer Science & Engineering
Primary Area: Neuromorphic computing
2017 - 2020
Email: aidanwolk@g.ucla.edu
Career: Stripe
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Jason Woo
Professor
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
Email: woo@ee.ucla.edu
Research Lab: CMOS Research Laboratory
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Yilin (Lenny) Wu
Computer Science and Applied Mathematics
Primary Area: Undecided
2021 - 2023
Email: lenny.wu@ucla.edu
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Tianyu Xiang
MS, Electrical & Computer Engineering
Primary Area: Circuits & Embedded Systems
2021 - 2023
Email: txiang@g.ucla.edu
Dharani Jaya Yakkaluru
Materials Science and Engineering
Primary Research Interests: Laser Drilled TSVs
2022 - 2023
Email: dharanijaya09@g.ucla.edu
Career: Apple, Inc.
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Cheng-Ting (Michael) Yang
MS, Material Science and Engineering
Primary Area: TBD
2023-2024
Email: ctyang@g.ucla.edu
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Yu-Tao (Ray) Yang
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2018 - 2022
Career: Mediatek
Email: yutaoyang@g.ucla.edu
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Jingxuan Zhu
Electrical and Computer Engineering
Primary Area: Circuits and Embedded Systems
2022-2023
Email: jingxuz4@g.ucla.edu
Jacklyn Zhu
Materials Science and Engineering
Primary Research Interests: Physical and Wave Electronics
2023 - Present
Email: jazhu24@g.ucla.edu