Mission Statement

Interpret and implement Moore’s Law to include all aspects of heterogeneous systems and develop architectures, methodologies, designs, components, materials and manufacturable integration schemes, that will shrink system footprint and improve power and performance.

Join our mailing list


Expect a Wave of Wafer-Scale Computers TSMC tech allows for one version now and a more advanced version in 2027

At TSMC’s North American Technology Symposium on Wednesday, the company detailed both its semiconductor technology and chip-packaging technology road maps. While the former is key to keeping the traditional part of Moore’s Law going, the latter could accelerate a trend toward processors made from more and more silicon, leading quickly...

CHIPS for America Announces Funding Opportunity to Expand U.S. Semiconductor Packaging

The U.S. Department of Commerce issued a Notice of Funding Opportunity (NOFO) to seek applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors.

Subramanian Iyer Joins the CHIPS for America Research and Development Office

Subramanian S. Iyer has joined CHIPS for America’s Research and Development (R&D) Office as the director of the National Advanced Packaging Manufacturing Program (NAPMP).

See more


2021 UCLA CHIPS Workshop December 1, 2021

UCLA Luskin Conference Center

See more

Contact Me!

Hello, I am Joseph Camyre, the Webmaster for CHIPS Lab! If you run into any issues with the website, please don't hesitate to send me an email at jcamyre127@g.ucla.edu!