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Mission Statement

Interpret and implement Moore’s Law to include all aspects of heterogeneous systems and develop architectures, methodologies, designs, components, materials and manufacturable integration schemes, that will shrink system footprint and improve power and performance.

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News


How Chip Designers Are Breaking Moore’s Law

If microchips were cities, the new, industrywide strategy for making them better could be summed up in one word: sprawl. In some case, the chips inside our most powerful devices are taking up so much real estate they hardly qualify as “micro” anymore. One way engineers are...

Micron Is First to Deliver 3D Flash Chips With More Than 200 Layers

232-layer NAND makes tiny 2-terabyte products that deliver data 50 percent faster: Boise, Idaho–based memory manufacturer Micron Technology says it has reached volume production of a 232-layer NAND flash-memory chip. It’s the first such chip to pass the 200-layer mark, and it’s been a tight race. Competitors are currently providing...

Professor Subramanian Iyer Weighs In - 3DInCites Podcast: "Conversations About What We Learned From ECTC 2022"

[Listen to the exclusive interview by clicking "Read more" below!] In Part 1 of ECTC 2022 coverage, Françoise catches up with some of the industry visionaries at key companies in the microelectronics space, as well as 3D technology research institutes to find out what they shared and...

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Conferences


2021 UCLA CHIPS Workshop December 1, 2021

UCLA Luskin Conference Center

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