Interpret and implement Moore’s Law to include all aspects of heterogeneous systems and develop architectures, methodologies, designs, components, materials and manufacturable integration schemes, that will shrink system footprint and improve power and performance.
Subramanian S. Iyer has joined CHIPS for America’s Research and Development (R&D) Office as the director of the National Advanced Packaging Manufacturing Program (NAPMP).
U.S. Focuses on Invigorating ‘Chiplets’ to Stay Cutting-Edge in Tech Chiplets, a way to design chips for higher performance, has become a key prong of U.S. industrial policy. But pushing for more of this activity domestically is challenging. “Packaging is where the action is going to...
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