Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies

The Biden-Harris Administration has issued a Notice of Funding Opportunity (NOFO) under the CHIPS and Science Act, offering up to $1.6 billion to advance U.S. semiconductor packaging technologies. This investment supports the National Advanced Packaging Manufacturing Program's goal to establish a competitive and self-sustaining domestic advanced packaging industry, enhancing chip performance while reducing costs and power consumption.