NEXTFLEX Innovation Days 2020 - Flexible Hybrid Electronics 2.0
Subramanian Iyer

ECTC 2020 - Heterogeneous Integration and AI, Why the hype?
Subramanian Iyer

MEPTEC panel on Known Good Die, June 2020 (via Youtube)

Panel Discussion
Michael Alfano
- Fellow in the Advanced Packaging and Memory Technologies Group at AMD
David Armstrong - Director Business Development at Advantest; Chair of Test Working Group of the Heterogenous Integration Roadmap
Dr. Lihong Cao - Director in ASE Group
Phil Nigh - Broadcom
Subramanian S. Iyer (Subu) - University of California at Los Angeles
Bob Patti - President of NHanced Semiconductors, Inc.
Ira Feldman - Principal Consultant at Feldman Engineering; MEPTEC Executive Director & General Chair of TestConX