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Publications


  1. AI computing reaches for the edge - Subramanian S. Iyer and Vwani Roychowdhury
  2. A. Kuchhangi, H. Ren, K. Sahoo, and S. S. Iyer, “Large Wafer GaN on Silicon Reconstitution with Gold-to-Gold Thermocompression Bonding,” in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), May 2023, pp. 1633–1637. doi: 10.1109/ECTC51909.2023.00277.
  3. H. Ren, K. Sahoo, T. Xiang, G. Ouyang, and S. S. Iyer, “Demonstration of a Power-efficient and Cost-effective Power Delivery Architecture for Heterogeneously Integrated Wafer-scale Systems,” in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), May 2023, pp. 1614–1621. doi: 10.1109/ECTC51909.2023.00274.
  4. G. Ouyang, T. Fukushima, H. Ren and S. S. Iyer, "3D flexible Fan-Out Wafer-Level Packaging for Wearable Devices," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 601-605, doi: 10.1109/ECTC51909.2023.00106.
  5. K. Sahoo, H. Ren and S. S. Iyer, "A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 362-366, doi: 10.1109/ECTC51909.2023.00067.
  6. T. Fukushima, T. Xiang, H. Ranjan, N. Tripathi, C. Liu, G. Ouyang, R. Irwin, and S.S. Iyer, "Advanced Packaging Methods Used for Energy Storage from Intermittent Renewable Sources," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 444-449, doi: 10.1109/ECTC51909.2023.00080.
  7. Sepideh Nouri and Subramanian S. Iyer, "An 8T eNVSRAM Macro in 22nm FDSOI Standard Logic with Simultaneous Full-Array Data Restore for Secure IoT Devices," 2022 IEEE International Solid- State Circuits Conference (ISSCC).
  8. S. Qiao, S. Moran, D. Srinivas, S. Pamarti and S. S. Iyer, "Demonstration of Analog Compute-In-Memory Using the Charge-Trap Transistor in 22 FDX Technology," 2022 International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 2022, pp. 2.5.1-2.5.4, doi: 10.1109/IEDM45625.2022.10019527.
  1. S. S. Nagi, U. Rathore, K. Sahoo, T. Ling, S. S. Iyer and D. Marković, "A 16-nm 784-Core Digital Signal Processor Array, Assembled as a 2 x 2 Dielet With 10 um Pitch Interdielet I/O for Runtime Multiprogram Reconfiguration," in IEEE Journal of Solid-State Circuits, 2022, doi: 10.1109/JSSC.2022.3212685.
  2. K. T. Kannan, B. Vaisband, K. Sahoo and S. S. Iyer, "An On-Chip ESD Sensor for Use in Advanced Packaging," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 7, pp. 1051-1062, July 2022, doi: 10.1109/TCPMT.2022.3177663.
  3. U. Rathore, S. S. Nagi, S. Iyer and D. Marković, "A 16nm 785GMACs/J 784-Core Digital Signal Processor Array With a Multilayer Switch Box Interconnect, Assembled as a 2×2 Dielet with 10μm-Pitch Inter-Dielet I/O for Runtime Multi-Program Reconfiguration," 2022 IEEE International Solid- State Circuits Conference (ISSCC), 2022, pp. 52-54, doi: 10.1109/ISSCC42614.2022.9731582.
  4. Yu-Tao Yang, Haoxiang Ren, Su Kong Chong, Gang Qiu, Shu-Yun Ku, Yang Cheng, Chaowei Hu, Tiema Qian, Kuan-Neng Chen, Ni Ni, Kang L. Wang, and Subramanian 3 S. Iyer, “RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for future large-scale quantum applications,” 72rd IEEE Electronic Components and Technology Conference (ECTC), San Diego, USA, May 2022, pp. 949-955.
  5. G. Ouyang, E. MacInnis, H. Sun, G. Whang, H. Ren, R. Irwin, B. Dunn, S. S. Iyer, "Fabrication of Flexible Li-ion Battery Electrodes Using “Battlets” Approach with Ionic Liquid Electrolyte for Powering Wearable Devices," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022.
  6. H. Ren, Y.-T. Yang, S. S. Iyer, "Recess Effect Study and Process Optimization of Sub-10 μm Pitch Die-to-wafer Hybrid Bonding," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022.
  7. H. Sun, G. Ezhilarasu, G. Ouyang, R. Irwin, S. S. Iyer, "A Heterogeneously Integrated and Flexible Inorganic Micro-display on FlexTrateTM using Fan-Out Wafer-Level Packaging," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022.
  8. P. Venkatesh, R. Irwin, A. Alam, M. Molter, A. Kapoor, B. Gaonkar, L. Macyszyn, M. Selvan Joseph, S. S. Iyer, "Smartphone App-Enabled Flex sEMG Patch using FOWLP," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022.
  9. R. Irwin, S. S. Iyer, "Characterization and Design Improvement of a High Bandwidth, High Frequency Flexible Connector for Signal Delivery," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022.
  10. G. Sabbir, S. S. Iyer, "Ultra-High Conductivity Interconnects for 77K CMOS Using Heterogeneous Integration," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022.
  11. H. Ren, S. Pal, G. Ouyang, R. Irwin, Y.-T. Yang, S. S. Iyer, "TSV-less Power Delivery for Wafer-scale Assemblies and Interposers," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022.
  12. K. Sahoo, U. Rathore, S. Chandra Jangam, T. Nguyen, D. Markovic, S. S. Iyer, "Functional Demonstration of < 0.4-pJ/bit, 9.8 μm Fine-Pitch Dielet-to-Dielet Links for Advanced Packaging using Silicon Interconnect Fabric," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 2022.
  13. Yu-Tao Yang, Haoxiang Ren ,Chaowei Hu, Peng Zhang, Ni Ni, Kang L. Wang, and Subramanian S. Iyer, “Fine-Pitch (≤10 μm) Nb-based Superconducting Silicon Interconnect Fabric for Large-Scale Quantum System Application,” Center for Design -Enabled Nanofabrication Berkeley UCLA UCSD (C-DEN) Workshop Integration, Fremont, USA, May 2022.
  14. Yu-Tao Yang, Haoxiang Ren,Chaowei Hu, Peng Zhang, Ni Ni, Kang L. Wang, and Subramanian S. Iyer, “Emerging Applications Using Niobium-based Superconducting Silicon Interconnect Fabric,” 7th Annual Critical Material Conference (CMC), Arizona, Apr. 2022.
  15. Zhe Wan, T. Wang, Y. Zhou, S. S Iyer, and V. Roychowdhury, "Accuracy and Resiliency of Analog Compute-in-Memory Inference Engines," ACM Journal on Emerging Technologies in Computing Systems (JETC), vol. 18, no. 2, pp. 1-23, April 2022.
  1. Y.-T. Yang, C. Hu, P. Zhang, H. Ren, N. Ni, K. L. Wang, and S. S. Iyer, "Fine-Pitch (≤10 μm) Nb-based Superconducting Silicon Interconnect Fabric for Large-Scale Quantum System Application," IEEE International Electron Devices Meeting (IEDM), San Francisco, Dec. 2021, pp. 873-876.
  2. K. Sahoo, B. Vinnakota, S. Ardalan and S. S. Iyer, "Co-optimizing signaling protocol with semiconductor and packaging technology," 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609161.
  3. U. Shah, S. S. Iyer and T. S. Fisher, "Segmented Thermal Management with Flash Cooling for Heterogeneous Wafer-Scale Systems," 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, pp. 589-594, doi: 10.1109/ITherm51669.2021.9503210.
  4. Y.-T. Yang, C. Hu, P. Zhang, N. Shakoorzadeh, H. Ren, N. Ni, K. Wang, and S. S. Iyer, "Nb-Based Superconducting Silicon Interconnect Fabric for Cryogenic Computing Applications," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1577-1582, doi: 10.1109/ECTC32696.2021.00250.
  5. A. Alam, M. Molter, A. Kapoor, B. Gaonkar, S. Benedict, L. Macyszyn, M. S. Joseph, and S. S. Iyer, "Flexible heterogeneously integrated low form factor wireless multi-channel surface electromyography (sEMG) device," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1544-1549, doi: 10.1109/ECTC32696.2021.00245.
  6. S. Pal, K. Sahoo, I. Alam, H. Suhail, R. Kumar, S. Pamarti, P. Gupta, and S. S. Iyer, "I/O Architecture, Substrate Design, and Bonding Process for a Heterogeneous Dielet-Assembly based Waferscale Processor," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 298-303, doi: 10.1109/ECTC32696.2021.00057.
  7. G. Ouyang, G. Whang, E. MacInnis and S. S. Iyer, "Fabrication of Flexible Ionic-Liquid Thin Film Battery Matrix on FlexTrate™ for Powering Wearable Devices," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1620-1626, doi: 10.1109/ECTC32696.2021.00257.
  8. K. Sahoo, S. Pal, N. Shakoorzadeh, Y. -T. Yang and S. S. Iyer, "Copper to gold thermal compression bonding in heterogenous wafer-scale systems," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 487-493, doi: 10.1109/ECTC32696.2021.00088.
  9. R. Irwin, K. Sahoo, S. Pal and S. S. Iyer, "Flexible Connectors and PCB Segmentation for Signaling and Power Delivery in Wafer-Scale Systems," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 507-513, doi: 10.1109/ECTC32696.2021.00091.
  10. G. Ouyang, G. Ezhilarasu, H. Sun, H. Ren, Y. -T. Yang and S. S. Iyer, "A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 2266-2271, doi: 10.1109/ECTC32696.2021.00355.
  11. K. T. Kannan and S. S. Iyer, "Novel high-power delivery architecture for heterogeneous Integration systems," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 164-169, doi: 10.1109/ECTC32696.2021.00037.
  12. N. S. Chase, R. Irwin, Y. T. Yang, H. Ren and S. S. Iyer, "Reliability Considerations for Wafer Scale Systems," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 84-89, doi: 10.1109/ECTC32696.2021.00025.
  13. H. Ren, Y.-T. Yang, G. Ouyang, and S. S. Iyer, "Mechanism and Process Window Study for Die-to-Wafer (D2W) Hybrid Bonding," in ECS Journal of Solid State Science and Technology, vol. 10, no. 6, 2021. https://doi.org/10.1149/2162-8777/ac0a52
  14. U. Shah, M. Ma, M. T. Barako, A. Bar-Cohen, S. S. Iyer and T. S. Fisher, "Experimental Demonstration of Pressure-Driven Flash Boiling for Transient Two-Phase Cooling," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 10, pp. 1604-1614, Oct. 2021, doi: 10.1109/TCPMT.2021.3085876.
  15. S. Pal, J. Liu, I. Alam, N. Cebry, H. Suhail, S. Bu, S. S. Iyer, S. Pamarti, R. Kumar, and P. Gupta, "Designing a 2048-Chiplet, 14336-Core Waferscale Processor", in 2021 ACM/IEEE Design Automation Conference, San Francisco, CA, USA
  16. S. C. Jangam and S. S. Iyer, "Silicon-Interconnect Fabric for Fine-pitch (≤10 μm) Heterogeneous Integration," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2021.3075219
  17. N. Shakoorzadeh, and S. S. Iyer, "Reliability Considerations for Wafer Scale Systems," GOMACTech Conference, March 2021.
  18. R. Irwin, and S. S. Iyer, "Signal and Power Delivery using Flexible, High-Speed Connectors and Segmented PCBs for System-on-Wafer Applications," GOMACTech Conference, March 2021.
  19. U. Shah, K. Kalappurakal, T. S. Fisher, and S. S. Iyer, "Segmented Power Delivery and Thermal Management for Heterogenous Wafer-scale Systems," GOMACTech Conference, March 2021.
  20. Rabiei E, Huang L, Chien H-Y et al., "Method and software platform for electronic COTS parts reliability estimation in space applications," Proceedings of the Institution of Mechanical Engineers, Part O: Journal of Risk and Reliability, March 2021. doi:10.1177/1748006X21998231
  21. Y.-T. Yang, C. Hu, P. Zhang, N. Shakoorzadeh, N. Ni, K. L. Wang, and S. S. Iyer, "Nb-based Superconducting Silicon Interconnect Fabric for cryogenic electronics," Quantum Science and Technology, vol. 6, no. 2, pp. 1-14, 2021. DOI: http://doi.org/10.1088/2058-9565/abe279
  22. R. M. Brewer, J. Cox, D. R. Ball, S. Moran, B. D. Sierawski, P. F. Wang, E. X. Zhang, D. M. Fleetwood, R. D. Schrimpf, S. S. Iyer, and M. L. Alles, "Total Ionizing Dose Responses of 22 nm FDSOI and 14 nm Bulk FinFET Charge-Trap Transistors," in IEEE Transactions on Nuclear Science, doi: 10.1109/TNS.2021.3059594.
  1. Rachel M. Brewer, J. Cox, D. R. Ball, S. Moran, B. D. Sierawski, P. F. Wang, E. X. Zhang, D. M. Fleetwood, R. D. Schrimpf, S. S. Iyer, and M. L. Alles, "Total Ionizing Dose Response of 22nm FDSOI Charge-Trap Transistors", 2020 IEEE Nuclear and Space Radiation Effects Conference, Dec. 1-4, 2020, Santa Fe, NM. (Accepted)
  2. Sepideh Nouri and Subramanian S. Iyer, "Non-Volatile Wideband Frequency Tuning of a Ring-Oscillator by Charge Trapping in High-k Gate Dielectric in 22nm CMOS," in IEEE Electron Device Letters, doi: 10.1109/LED.2020.3036080.
  3. N.Shakoorzadeh, S.S.Iyer, “Atomic Layer Deposited Al­2O3 for Encapsulation of the Silicon Interconnect Fabric “, 2020 Semiconductor Research Corporation Technical Conference (SRC TechCon) TechCon
  4. S. Jangam and S. S. Iyer, "A Signaling Figure of Merit (s-FoM) for Advanced Packaging," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2020.3022760
  5. Z. Wan, T. Wang, Y. Zhou, S. S. Iyer, V. P. Roychowdhury, "Accuracy and Resiliency of Analog Compute-in-Memory Inference Engines." arXiv preprint arXiv:2008.02400 (2020).
  6. A. Alam, M. Molter, B. Gaonkar, A. Hanna, R. Irwin, S. Benedict, G. Ezhilarasu, L. Macyszyn, M. S. Joseph, and S. S. Iyer, "A High Spatial Resolution Surface Electromyography (sEMG) System Using Fan-Out Wafer-Level Packaging on FlexTrate™," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 985-990, doi: 10.1109/ECTC32862.2020.00160.
  7. K. T. Kannan and S. S. Iyer, "Deep Trench Capacitors in Silicon Interconnect Fabric," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 2295-2301, doi: 10.1109/ECTC32862.2020.00358.
  8. A. Dasgupta, A. Alam, G. Ouyang, S. Jangam and S. S. Iyer, "Antenna on Silicon Interconnect Fabric," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 1788-1794, doi: 10.1109/ECTC32862.2020.00279.
  9. S. Benedict, A. Nagarajan, T. Kumar, A. Alam, M. S. Illango, G. Ezhilarasu, C. S. Prajapati, N. Bhat, and S. S. Iyer, "Heterogenous Integration of MEMS Gas Sensor using FOWLP : Personal Environment Monitors," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 824-828, doi: 10.1109/ECTC32862.2020.00134.
  10. S. Jangam, U. Rathore, S. Nagi, D. Markovic and S. S. Iyer, "Demonstration of a Low Latency (<20 ps) Fine-pitch (≤10 μm) Assembly on the Silicon Interconnect Fabric," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 1801-1805, doi: 10.1109/ECTC32862.2020.00281.
  11. Y. Yang, C. Hu, J. Green, P. Zhang, N. Shakoorzadeh, P. Ambhore, U. Mogera, N. Ni, K. L. Wang, and S. S. Iyer, "Demonstration of Superconducting Interconnects on the Silicon Interconnect Fabric Using Thermocompression Bonding," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 1861-1866, doi: 10.1109/ECTC32862.2020.00291.
  12. R. Irwin, Y. Hu, A. Alam, S. Benedict, T. Fisher and S. S. Iyer, "Nanowire Impregnated Poly-dimethyl Siloxane for Flexible, Thermally Conductive Fan-Out Wafer-Level Packaging," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 1548-1553, doi: 10.1109/ECTC32862.2020.00243.
  13. G. Ezhilarasu, A. Paranjpe, J. Lee, F. Wei and S. S. Iyer, "A Heterogeneously Integrated, High Resolution and Flexible Inorganic μLED Display using Fan-Out Wafer-Level Packaging," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 677-684, doi: 10.1109/ECTC32862.2020.00112.
  14. N. Shakoorzadeh, K. Sahoo, Y.T. Yang, and S.S. Iyer, "Atomic Layer Deposited Al2O3 Encapsulation for the Silicon Interconnect Fabric." 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (2020): 1241-1246, doi: 10.1109/ectc32862.2020.00198.
  15. S. Roymohapatra, G. Gore, A. Yadav, M. Patil, K. Rengarajan, S. S. Iyer, M. Baghini, "A Novel Hierarchical Circuit LUT Model for SOI Technology for Rapid Prototyping," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 39, no. 5, pp. 1073-1083, May 2020, doi: 10.1109/TCAD.2019.2907879.
  16. Saptadeep Pal, Daniel Petrisko, Rakesh Kumar, and Puneet Gupta, "Design Space Exploration for Chiplet-Assembly-Based Processors," in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 28, no. 4, pp. 1062-1073, April 2020.
  17. E. Hunt-Schroeder, D. Anand, D. Pontius, M. Roberge, D. Moy, E. Banghart, N. Robson, F. Khan, T. Kirihata, S. Ventrone, "Design and Development Challenges of Charge Trap Transistor Memories", GOMACTech, 2020.
  18. Steven Moran, J. Cox, Z. Wan, R. Brewer, E. X. Zhang, B. Sierawski, J. Woo, and S. S. Iyer, "Impacts of Perturbation on a Charge Trap Transistor Analog Neural Network", GOMACTech-20, Microelectronics for a New Decade: Global Competition and Near-Peer Challenges, March 16-19, 2020, San Diego, CA. (Accepted)
  19. Arsalan Alam, Michael Molter, and Subramanian S. Iyer, "Development of FlexTrateTM using Fan-Out-Wafer-Level-Packaging (FOWLP) and to demonstrate fully integrated multi-channel flexible surface Electromyography (sEMG) system," Flex 2020, San Jose, CA, February 24-27, 2020
  20. Faraz Khan, "Charge Trap Transistors (CTT): A Process/Mask-Free Secure Embedded Non-Volatile Memory for 14 nm FinFET Technologies and Beyond", Microelectronics Reliability and Qualification Workshop (MRQW), 2020 [Invited].
  1. Rachel Brewer, S. Moran, J. Cox, B. Sierawski, M. McCurdy, E. X. Zhang, S. S. Iyer, R. D. Schrimpf, M. Alles, and R. Reed, "The impact of proton-induced single events on image classification in a neuromorphic architecture," in IEEE Transactions on Nuclear Science, vol. 67, no. 1, pp. 108-115, Dec. 2019.
  2. S. S. Iyer, S. Jangam, and B. Vaisband, "Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems," in IBM Journal of Research and Development, vol. 63, no. 6, pp. 5:1-5:16, 1 Nov.-Dec. 2019.
  3. Boris Vaisband and S. S. Iyer, "Global and Semi-Global Communication on Silicon Interconnect Fabric", Proceedings of the IEEE/ACM International Symposium on Networks-on-Chip, pp. 15:1-15:5, October 2019.
  4. Xuefeng Gu, Z. Wan and S. S. Iyer, "Charge-Trap Transistors for CMOS-Only Analog Memory," in IEEE Transactions on Electron Devices, vol. 66, no. 10, pp. 4183-4187, Oct. 2019.
  5. Y. Du et al., "An Analog Neural Network Computing Engine Using CMOS-Compatible Charge-Trap-Transistor (CTT)," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 38, no. 10, pp. 1811-1819, Oct. 2019, doi: 10.1109/TCAD.2018.2859237.
  6. P. Gupta and S. S. Iyer, "Goodbye, motherboard. Bare chiplets bonded to silicon will make computers smaller and more powerful: Hello, silicon-interconnect fabric," in IEEE Spectrum, vol. 56, no. 10, pp. 28-33, Oct. 2019, doi: 10.1109/MSPEC.2019.8847587.
  7. Rachel Brewer, S. Moran, J. Cox, B. Sierawski, M. McCurdy, S. S. Iyer, M. Alles, and R. Reed, "The impact of proton-induced single events on image classification in a neuromorphic architecture," 2019 IEEE Nuclear and Space Radiation Effects Conference, July 8-12, 2019, San Antonio, TX.
  8. Faraz Khan, M. Han, D. Moy, R. Katz, L. Jiang, E. Banghart, N. Robson, T. Kirihata, J. C. S. Woo, and S. S. Iyer, "Design Optimization and Modeling of Charge Trap Transistors (CTTs) in 14 nm FinFET Technologies," IEEE Electron Device Letters, July 2019.
  9. Faraz Khan, D. Moy, D. Anand, E. Hunt-Schroeder, R. Katz, L. Jiang, E. Banghart, N. Robson, and T. Kirihata, "Turning Logic Transistors into Secure, Multi-Time Programmable, Embedded Non-Volatile Memory Elements for 14 nm FINFET Technologies and Beyond," IEEE Symposium on VLSI Technology, Kyoto, Japan, June 2019.
  10. Boris Vaisband and S. S. Iyer, "Communication Considerations for Silicon Interconnect Fabric," Proceedings of the ACM/IEEE International Workshop on System Level Interconnect Prediction, June 2019.
  11. Siva Chandra Jangam, A. Bajwa, U. Mogera, P. Ambhore, T. Colosimo, T. Palumbo, D. DeAngelis, B. Chylak and S. S. Iyer, "Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects using In-situ Formic Acid Vapor Treatment", IEEE 69th Electronic Components and Technology Conference (ECTC), May 28-31, 2019, Las Vegas, NV.
  12. Kannan K. Thankappan, B. Vaisband, S. S. Iyer, "On-Chip ESD Monitor", IEEE 69th Electronic Components and Technology Conference (ECTC), May 28-31, 2019, Las Vegas, NV.
  13. Goutham Ezhilarasu, A. Hanna, A. Paranjpe, and S. Iyer, "High Yield Precision Transfer and Assembly of GaN µLEDs using Laser Assisted Micro Transfer Printing", IEEE 69th Electronic Components and Technology Conference (ECTC), May 28-31, 2019, Las Vegas, NV.
  14. Meng-Hsiang Liu, B. Vaisband, A. Hanna, Y. Luo, Z. Wan and S. S. Iyer, "Process Development of Power Delivery Through Wafer Vias for Silicon Interconnect Fabric", IEEE 69th Electronic Components and Technology Conference (ECTC), May 28-31, 2019, Las Vegas, NV.
  15. Arsalan Alam, A. Hanna, R. Irwin, G. Ezhilarasu, H. Boo, Y. Hu, C. W. Wong, T. S. Fisher, and S. S. Iyer, "Heterogeneously Integrated Foldable Display on Elastomeric Substrate Based on Fan-Out Wafer Level Packaging", IEEE 69th Electronic Components and Technology Conference (ECTC), May 28-31, 2019, Las Vegas, NV.
  16. Pranav Ambhore, B. Vaisband, U. Mogera, U. Shah, T. Fisher, M. Goorsky, and S. S. Iyer, "PowerTherm Attachment Process for Power Delivery and Heat Extraction in the Silicon-Interconnect Fabric", IEEE 69th Electronic Components and Technology Conference (ECTC), May 28-31, 2019, Las Vegas, NV.
  17. Ujash Shah, U. Mogera, P. Ambore, B. Vaisband, S. S. Iyer, and T. S. Fisher, "Dynamic Thermal Management for Silicon Interconnect Fabric using Flash Cooling," Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 2019.
  18. Niloofar Shakoorzadeh, S. Jangam, P. Ambhore, H. Chien, A. Hanna, S. S. Iyer, "Reliability Studies of Si Interconnect Fabric (Si-IF)", IEEE 69th Electronic Components and Technology Conference (ECTC), May 28-31, 2019, Las Vegas, NV.
  19. Eric Sorensen, B. Vaisband, S. Jangam, T. Shirley, and S. S. Iyer, "Integration and Characterization of InP Dies on Silicon Interconnect Fabric", IEEE 69th Electronic Components and Technology Conference (ECTC), May 28-31, 2019, Las Vegas, NV.
  20. N. Shakoorzadeh, A. Hanna, S. S. Iyer, "Bilayer Passivation Film For Cu Interconnects on Si Interconnect Fabric", IEEE International Reliability Physics Symposium, March 31 - April 4, 2019, Monterey, CA.
  21. Kannan K. Thankappan, A. Bajwa, B. Vaisband, S. Jangam, and S. S. Iyer, "Reliability Evaluation of Silicon Interconnect Fabric Technology", IEEE International Reliability Physics Symposium, March 31 - April 4, 2019, Monterey, CA.
  22. Faraz Khan, E. Hunt-Schroeder, D. Moy, D. Anand, R. Katz, D. Leu, J. Fifield, N. Robson, S. Ventrone, T. Kirihata, "A Multi-Time Programmable Embedded Memory Technology in a Native 14nm FINFET Process using Charge Trap Transistors (CTTs)," Proceedings of the Government Microcircuit Applications & Critical Technology (GOMACTech) Conference, March 2019.
  23. Subramanian S. Iyer, S. Jangam, and B. Vaisband, "From Homogeneous SoCs to Heterogeneous SoWs," Proceedings of the Government Microcircuit Applications & Critical Technology Conference (GOMACTech), March 2019.
  24. Steven Moran, J. Cox, R. Brewer, B. Sierawski, and S. S. Iyer, "Radiation Effects on Brain-Inspired Computing," GOMACTech-19, Artificial Intelligence & Cyber Security: Challenges and Opportunities for the Government, March 25-28, 2019, Albuquerque, NM.
  25. Zhe Wan, S. Moran, J. Cox, X. Gu, V. Rowchowdhury, and S. S. Iyer, "Characterization Approaches to Test the Robustness of Neuromorphic Systems," GOMACTech-19, Artificial Intelligence & Cyber Security: Challenges and Opportunities for the Government, March 25-28, 2019, Albuquerque, NM.
  26. Bilwaj Gaonkar, J. Beckett, D. Villaroman, C. Ahn, M. Edwards, S. Moran, M. Attiah, D.Babayan, C. Ames, J. P. Villablanca, N. Salamon, A. Bui, and L. Macyszyn, "Quantitative analysis of neural foramina in the lumbar spine: an imaging informatics and machine learning study," in Radiology: Artificial Intelligence, vol. 1, no. 2, Mar. 2019.
  27. Arsalan Alam and S. S. Iyer, "Heterogeneously Integrated Foldable Display on Elastomeric Substrate Based on Fan-Out Wafer Level Packaging", Flex 2019, February 18-21, 2019, Monterey, CA.
  28. Saptadeep Pal, D. Petrisko, M. Tomei, P. Gupta, S. S. Iyer, and R. Kumar, "Architecting Waferscale Processors: A GPU Case Study", in 25th IEEE International Symposium on High-Performance Computer Architecture (HPCA), February 16-20, 2019, Washington D.C., USA.
  1. E. Hunt-Schroeder, D. Anand, J. Fifield, M. Roberge, D. Pontius, M. Jacunski, K. Batson, M. Deming, F. Khan, D. Moy, A. Cestero, R. Katz, Z. Chbili, E. Banghart, J. Liu, B. Jayaraman, R. Tummuru, R. Raghavan, A. Mishra, N. Robson, T. Kirihata, "14nm FinFET 1.5Mb Embedded High-K Charge Trap Transistor One Time Programmable Memory Using Differential Current Sensing," IEEE SSC-L, 2019.
  2. Goutham Ezhilarasu, A. Hanna, R. Irwin, A. Alam, and S. S. Iyer, "A Flexible, Heterogeneously Integrated Wireless Powered System for Bio-Implantable Applications using Fan-Out Wafer-Level Packaging," 2018 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, 2018, pp. 29.7.1-29.7.4. doi: 10.1109/IEDM.2018.8614705
  3. Pranav Ambhore, K. Mani, B. Beekley, N. Malik, K. Schjølberg-Henriksen, S. Iyer, and M. S. Goorsky, "The Synergistic Roles of Temperature and Pressure in Thermo-Compression Bonding of Au," ECS Trans. 2018 volume 86, Issue 5, 129-135.
  4. Zhe Wan, K. Winstel, A Kumar and S. S. Iyer, "Low-Temperature Wafer Bonding for Three- Dimensional Wafer-Scale Integration," 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) Burlingame, CA, 2018.
  5. Takafumi Fukushima, A. Alam, A. Hanna, S. Jangam, A. Bajwa, and S. S. Iyer, "Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 10, pp. 1738-1746, Oct. 2018.
  6. Zhe Wan and S. Iyer, "Fine-Pitch Integration Technology for Cognitive System Scaling," 2018 Semiconductor Research Corporation Technical Conference (SRC TechCon) TechCon, Austin, TX, 2018.
  7. Bau Pham, B. Gaonkar, W. Whitehead, S. Moran, Q. Dai, L. Macyszyn, and V. R. Edgerton, "Cell Counting and Segmentation of Immunohistochemical Images in the Spinal Cord: Comparing Deep Learning and Traditional Approaches," 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Jul. 2018.
  8. SivaChandra Jangam, A. Bajwa, K. K. Thankappan, P. Kittur, and S. S. Iyer, "Electrical Characterization of High Performance Fine Pitch Interconnects in Silicon-Interconnect Fabric," IEEE 68th IEEE Electronic Components and Technology Conference (ECTC), May 29-June 1, 2018, San Diego, CA.
  9. Adeel Bajwa, S. Jangam, S. Pal, B. Vaisband, R. Irwin, M. Goorsky, and S. S. Iyer "Demonstration of a Heterogeneously Integrated System-on-Wafer (SoW) assembly," IEEE 68th IEEE Electronic Components and Technology Conference (ECTC), May 29-June 1, 2018, San Diego, CA.
  10. Takafumi Fukushima, Y. Susumago, H. Kino, T. Tanaka, A. Alam, A. Hanna, and S. S. Iyer "Self-Assembly Technologies for FlexTrate™," IEEE 68th IEEE Electronic Components and Technology Conference (ECTC), May 29-June 1, 2018, San Diego, CA.
  11. Amir Hanna, T. Fukushima, A. Alam, S. Moran, W. Whitehead, S. Jangam, R. Irwin, A. Bajwa, S. Pal, and S. S. Iyer, "Extremely Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-based Interconnects," IEEE 68th IEEE Electronic Components and Technology Conference (ECTC), May 29-June 1, 2018, San Diego, CA.
  12. Rachel M. Brewer, S. Moran, J. Cox, M. McCurdy, R. Erbrick, M. Alles, R. Reed, S. S. Iyer, and B. Sierawski, "Proton-Induced Classification Changes in a Neuromorphic Computing System," 2018 Single Event Effects (SEE) Symposium, May 20-24, 2018, San Diego, CA.
  13. Subramanian S. Iyer and Adeel Ahmad Bajwa, "Reliability challenges in advance packaging," 2018 IEEE International Reliability Physics Symposium (IRPS), March 11-15, 2018.
  14. William Whitehead, S. Moran, B. Gaonkar, L. Macyszyn, and S. S. Iyer, "A Deep Learning Approach to Spine Segmentation using a Feed-forward Chain of Pixel-wise Convolutional Networks," IEEE International Symposium on Biomedical Imaging (ISBI), April 4-7, 2018, Washington D.C.
  15. B. Vaisband, A. Bajwa, and S. S. Iyer, “Network on Interconnect Fabric,” Proceedings of the IEEE International Symposium on Quality Electronic Design, March 2018.
  16. Steven Moran, B. Gaonkar, W. Whitehead, A. Wolk, L. Macyszyn, and S. S. Iyer, "Deep Learning for Medical Image Segmentation – Using the IBM TrueNorth Neurosynaptic System", SPIE Medical Imaging, Feb 10-15, 2018.
  17. B. Jayaraman et al., "80-kb Logic Embedded High-K Charge Trap Transistor-Based Multi-Time-Programmable Memory With No Added Process Complexity," in IEEE Journal of Solid-State Circuits, vol. 53, no. 3, pp. 949-960, March 2018, doi: 10.1109/JSSC.2017.2784760.
  18. Saptadeep Pal, D. Petrisko, A. Bajwa, P. Gupta, S. S. Iyer, and R. Kumar "A Case for Packageless Processors", 24th IEEE International Symposium on High-Performance Computer Architecture (HPCA), February 24-28, 2018, Vienna, Austria.
  19. Amir Hanna, "Flexible (1mm bending radius) Biocompatible Heteregeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6µm) and Reliable Flexible Cu-based Interconnects", Semi 2018 Flex, February 12-15, 2018, Monterey, CA.
  20. Elaheh Rabiei, M. White, A. Mosleh, S. Lyer and J. Woo, "Component Reliability Modeling Through the Use of Bayesian Networks and Applied Physics-based Models," 2018 Annual Reliability and Maintainability Symposium (RAMS), Reno, NV, 2018, pp. 1-7.
  1. Faraz Khan, E. Cartier, J. C. S. Woo, and S. S. Iyer, "Charge Trap Transistor (CTT): An Embedded Fully Logic-Compatible Multiple-Time Programmable Non-Volatile Memory Element for High-k-Metal-Gate CMOS Technologies," IEEE Electron Device Letters, vol. 38, no. 1, 2017. doi: 10.1109/LED.2016.26334906
  2. Saptadeep Pal, S. S. Iyer, and P. Gupta, "Advanced packaging and heterogeneous integration to reboot computing," in IEEE International Conference on Rebooting Computing (ICRC), November 8-9, 2017, Washington, DC, USA. (Invited)
  3. Zhe Wan and S. S. Iyer, "Three-dimensional wafer scale integration for ultra-large-scale cognitive systems," 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), Burlingame, CA, 2017, pp. 1-2.
  4. R. M. Walker, L. Rieth, S. S. Iyer, A. A. Bajwa, J. Silver, T. Ahmed, N. Tasneem, M. Sharma, A. Gardner, "Integrated neural interfaces," 2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS), Boston, MA, USA, 2017, pp. 1045-1048. doi: 10.1109/MWSCAS.2017.8053106
  5. Xuefeng Gu, S. S. Iyer, "Unsupervised Learning Using Charge-Trap Transistors", IEEE Electron Device Letters, vol. 38, no. 9, pp. 1204-1207, Sept. 2017. doi: 10.1109/LED.2017.2723319
  6. Arsalan Alam, T. Fukushima, A. Hanna, S. C. Jangam, A. Bajwa, and S. S. Iyer, "FlexTrate™: For next generation high performance flexible systems", FlexTech Flexible & Printed Electronics Conference & Exhibition (2017 Flex), June 19-22, 2017, Monterey, CA.
  7. Adeel A. Bajwa, S. C. Jangam, S. Pal, N. Marathe, T. Bai, T. Fukushima, M. Goorsky, and S. S. Iyer, "Heterogeneous Integration at Fine Pitch (≤ 10 μm) using Thermal Compression Bonding", Proc. of 67th IEEE Electronic Components and Packaging Technology (ECTC) 2017, Orlando, FL, pp. 1276-1284. doi: 10.1109/ECTC.2017.240
  8. Takafumi Fukushima, A. Alam, S. Pal, Z. Wan, S. C. Jangam, G. Ezhilarasu, A. Bajwa, and S. S. Iyer, "“FlexTrate®” – Scaled Heterogeneous Integration on Flexible Biocompatible Substrates", Proc. of 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, pp. 649-654. doi: 10.1109/ECTC.2017.226
  9. SivaChandra Jangam, S. Pal, A. Bajwa, S. Parmarti, P. Gupta and S. S. Iyer, "Latency, Bandwidth and Power Benefits of the SuperCHIPS Integration Scheme", Proc. of 67th IEEE Electronic Components and Packaging Technology (ECTC) 2017, Orlando, FL, pp. 86-94. doi: 10.1109/ECTC.2017.246
  10. Arvind Kumar, Z. Wan, W. Wilcke, and S. S. Iyer, "Towards Human-Scale Brain Computing Using 3D Wafer Scale Integration," ACM Journal of Emerging Technologies in Computing, vol. 13, no. 3, article no. 45, Apr. 2017.
  11. Adeel A. Bajwa, S. S. Iyer, "Heterogeneous Integration and Scaling for Improved Performance", MEPTEC Report Spring 2017, pp. 18-21, Mar. 2017.
  12. Liheng Zhu, Y. Badr, S. Wang, S. S. Iyer, and P. Gupta, "Assessing Benefits of a Buried Interconnect Layer in Digital Designs," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 36, no. 2, pp. 346-350, Feb. 2017. doi: 10.1109/TCAD.2016.257214
  1. Chandrasekara Kothandaraman, S. Rosenblatt, J. Safran, P. Oldiges, P. Kulkarni-Kerber, J. Xumalo, W. Landers, J. Liu, J. A. Oakley, S. Butt, T. L. Graves-Abe, N. Robson, M. G. Farooq, D. Berger and S. S. Iyer, "Vertical channel devices enabled by through silicon via (TSV) technologies," 2016 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, 2016, pp. 9.6.1-9.6.4. doi: 10.1109/IEDM.2016.7838384
  2. Takafumi Fukushima, A. Alam, S. Pal, Z. Wan, S. C. Jangam, G. Ezhilarasu, A. Bajwa, and S. S. Iyer, "A New Flexible Device Integration Technology Based on Fan-Out Wafer-Level Packaging", Printed Electronics USA in IDTechEx show, p.96, Nov. 16-17, 2016, Santa Clara, CA, Academic Posters.
  3. Takafumi Fukushima, A. Alam, S. Pal, Z. Wan, S. C. Jangam, G. Ezhilarasu, A. Bajwa, and S. S. Iyer, "FlexTrate™: High Interconnect Density Fan-Out Wafer Level Processing for Flexible Bio-compatible Electronics", Proc. NBMC (Nano-Bio Manufacturing Consortium) Workshop: Blood, Sweat and Tears III, Nov. 2-3, 2016, Arlington, VA, invited.
  4. Adeel Bajwa, N. Marathe, S. C. Jangam, S. Pal, P. Y. Liu, M. Goorsky, and S. S. Iyer, "Process development and material characterization of Cu-Cu thermo-compression bonding (TCB) for high-conductivity electrical interconnects," International Symposium on Microelectronics (IMAPS): FALL 2016, vol. 2016, no. 1, pp. 203-208. doi: http://dx.doi.org/10.4071/isom-2016-WA42
  5. Janakiraman Viraraghavan, D. Leu, B. Jayaraman, A. Cestero, R. Kilker, M. Yin, J. Golz, R. R. Tummuru, R. Raghavan, D. Moy, T. Kempanna, F. Khan, T. Kirihata, and S. S. Iyer, "80Kb 10ns read cycle logic Embedded High-K charge trap Multi-Time-Programmable Memory scalable to 14nm FIN with no added process complexity," IEEE Symposium on VLSI Circuits (VLSI-Circuits), Honolulu, HI, 2016, pp. 1-2. doi: 10.1109/VLSIC.2016.7573462
  6. Brittany Hedrick, V. Sukumaran, B. Fasano, C. Tessler, J. Garant, J. Lubguban, S. Knickerbocker, M. Cranmer, K. Ramachandran, I. Melville, D. Berger, M. Angyal, R. Indyk, D. Lewison, C. Arvin, L. Guerin, M. Cournoyer, M. P. L. Ouellet, J. Audet, F. Baez, S. Li, and S. S. Iyer, "End-to-End Integration of a Multi-die Glass Interposer for System Scaling Applications," 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016, pp. 283-288. doi: 10.1109/ECTC.2016.261
  7. John Safran, G. N. K. Rangan, V. N. R. Vanukuru, S. Torgal, V. Chaturvedi, S. Butt, G. Maier, A. Cestero, T. Tran-Quinn, J. Nag, S. Rosenblatt, N. Robson, M. Angyal, T. Graves-Abe, D. Berger, J. Pape, and S. S. Iyer, "3Di DC-DC Buck Micro Converter with TSVs, Grind Side Inductors, and Deep Trench Decoupling Capacitors in 32nm SOI CMOS," 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016, pp. 1451-1456. doi: 10.1109/ECTC.2016.324
  8. Menglu Li, P. Periasamy, K. N. Tu and S. S. Iyer, "Optimized Power Delivery for 3D IC Technology Using Grind Side Redistribution Layers," 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016, pp. 2449-2454. doi: 10.1109/ECTC.2016.217
  9. Prakash Periasamy, Michael Iwatake, Menglu Li, Joyce Liu, Troy Graves-Abe, Thuy Tran Quinn, Subramanian S Iyer, "Electromigration Studies on 6 µm Solid Cu TSV (Via last) in 32 nm SOI Technology," 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016, pp. 1364-1369. doi: 10.1109/ECTC.2016.293
  10. Toshiaki Kirihata, J. Golz, M. Wordeman, P. Batra, G. W. Maier, N. Robson, T. L. Graves-abe, D. Berger, and S. S. Iyer, "Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 6, no. 3, pp. 373-384, Sept. 2016. doi: 10.1109/JETCAS.2016.2547738
  11. Arvind Kumar, Z. Wan, W. Wilcke, and S. S. Iyer. "3D Wafer Scale Integration: A Scaling Path to an Intelligent Machine." Neuro-Inspired Computational Elements, Berkeley, CA (2016).
  12. Subramanian S. Iyer, "Heterogeneous Integration for Performance and Scaling," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no.7, pp. 973-982, Jul. 2016. doi: 10.1109/TCPMT.2015.2511626
  13. Faraz Khan, E. Cartier, C. Kothandaraman, J. C. Scott, J. C. S. Woo, and S. S. Iyer, "The Impact of Self-Heating on Charge Trapping in High- k -Metal-Gate nFETs," Electron Device Letters, IEEE , vol. 37, no. 1, pp. 88-91, Jan. 2016. doi: 10.1109/LED.2015.2504952
  14. G. Fredeman et al., "A 14 nm 1.1 Mb Embedded DRAM Macro With 1 ns Access," in IEEE Journal of Solid-State Circuits, vol. 51, no. 1, pp. 230-239, Jan. 2016.
  1. Subramanian S. Iyer, T. Kirihata, "Three-Dimensional Integration: A Tutorial for Designers," in Solid-State Circuits Magazine, IEEE , vol. 7, no. 4, pp. 63-74, Fall 2015. doi: 10.1109/MSSC.2015.2474235
  2. Subramanian S. Iyer, "Monolithic three-dimensional integration for memory scaling and neuromorphic computing," 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), Rohnert Park, CA, 2015, pp. 1-7. doi: 10.1109/S3S.2015.7333508
  3. Subramanian S. Iyer, "Invited talk: Some challenges in scaling 3D ICs to a broader application set," 2015 International 3D Systems Integration Conference (3DIC), Sendai, Japan, 2015, pp. TS1.1.1-TS1.1.1. doi: 10.1109/3DIC.2015.7334470
  4. Gregory Fredeman, D. Plass, A. Mathews, J. Viraraghavan, K. Reyer, T. Knips, T. Miller, E. Gerhard, D. Kannambadi, C. Paone, D. Lee, D. Rainey, M. Sperling, M. Whalen, S. Burns, R. Tummuru, H. Ho, A. Cestero, N. Arnold, B. Khan, T. Kirihata, and S. S. Iyer, "A 14 nm 1.1 Mb Embedded DRAM Macro With 1 ns Access," in IEEE Journal of Solid-State Circuits, vol. 51, no. 1, pp. 230-239, Jan. 2016. doi: 10.1109/JSSC.2015.2456873
  5. Katsuyuki Sakuma, K. Tunga, B. Webb, K. Ramachandran, M. Interrante, H. Liu, M. Angyal, D. Berger, J. Knickerbocker, and S. S. Iyer, "An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates," 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2015, pp. 318-324. doi: 10.1109/ECTC.2015.7159611
  6. Chandrasekara Kothandaraman, X. Chen, D. Moy, D. Lea, S. Rosenblatt, F. Khan, D. Leu, T. Kirihata, D. Ioannou, G. La Rosa, J. Johnson, N. Robson, and S. S. Iyer, "Oxygen vacancy traps in Hi-K/Metal gate technologies and their potential for embedded memory applications," 2015 IEEE International Reliability Physics Symposium, Monterey, CA, 2015, pp. MY.2.1-MY.2.4. doi: 10.1109/IRPS.2015.7112816
  7. Muqta G. Farooq, G. La. Rosa, F. Chen, P. Periasamy, T. Graves-Abe, C. Kothandaraman, C. Collins, W. Landers, J. Oakley, J. Liu, J. Safran, S. Ghosh, S. Mittl, D. Ioannou, C. Graas, D. Berger, and S. S. Iyer, "Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability," 2015 IEEE International Reliability Physics Symposium, Monterey, CA, 2015, pp. 4C.1.1-4C.1.8. doi: 10.1109/IRPS.2015.7112732
  8. Subramanian S. Iyer, "Three-dimensional integration: An industry perspective," Materials challenges in 3D IC technology, MRS Bulletin, vol. 40, no. 3, pp. 225-232, Mar. 2015.