Subramanian S. Iyer
Director, UCLA CHIPS
Distinguished Professor and Charles P. Reames Endowed Chair
Electrical and Computer Engineering Department
Material Science and Enineering Department
Institute for Carbon Management
Primary Area: Physical and Wave Electronics
Secondary Area: Circuits and Systems
Office: 66-147H Engr. IV
Email: s.s.iyer@ucla.edu
Edit UserGoutham Ezhilarasu
Deputy Director, UCLA CHIPS
Dept: Electrical and Computer Engineering (Physical and Wave Electronics)
Primary Area: Advanced packaging, 3D Heterogeneous Integration (3DHI)
About: Dr. Ezhilarasu is currently working as an R&D engineer and serving as the Deputy Director of UCLA CHIPS. His independent research here focuses on Advanced Packaging and 3DHI, specifically in optimizing direct Cu-Cu TCB for fine bump-pitch (< 10 micron), multi-tier 3D stacking of chiplets for HPC applications and backside power delivery to wafer-scale systems.
Office: 66-127C, Eng. IV
Email: goutham93@ucla.edu
Edit UserTimothy Fisher
Professor | Mechanical and Aerospace Engineering
Primary Area: Transport processes by electrons, phonons, photons, and fluids
Email: tsfisher@ucla.edu
Research Lab: Nano Transport Group
Edit UserMark Goorsky
Associate Director, UCLA CHIPS
Professor | Materials Science & Engineering
Primary Area: High resolution X-ray diffraction, III-V, Ion Implantation, Epitaxial relaxation
Email: goorsky@seas.ucla.edu
Research Lab: Electronic Materials Group
Edit UserPuneet Gupta
Professor
Electrical and Computer Engineering
Primary Area: Circuits & Embedded Systems
Email: puneet@ee.ucla.edu
Research Lab: NanoCAD Laboratory
Edit UserSudhakar Pamarti
Professor & Area Director for Circuits and Embedded Systems
Electrical and Computer Engineering
Primary Area: Circuits and Embedded Systems
Email: spamarti@ee.ucla.edu
Research Lab: Signal Processing and Circuit Engineering (SPACE)
Edit UserTiwei Wei
Associate Director, UCLA CHIPS
Assistant Professor | Mechanical and Aerospace Engineering
Primary Area: Processing, materials and reliability for ultra-high density 3D
IC; Heterogeneous Integration; Thermal Management;
Email: tiwei32@ucla.edu
Edit User