UCLA CHIPS Presentations at ECTC 2020 Jun 3, 2020 12:00 AM - Jun 30, 2020 12:00 AM

UCLA CHIPS Presentations at ECTC 2020

June 3 - 30, 2020 - Virtual Conference (Registration link)

A High Spatial Resolution Surface Electromyography (sEMG) System Using Fan-Out Wafer-Level Packaging on FlexTrateTM
Alam, Arsalan (Session 22, Talk 3)

Heterogenous Integration of MEMS Gas Sensor using FOWLP : Personal Environment Monitors
Benedict, Samatha (Session 18, Talk 3)

Antenna on Silicon Interconnect Fabric
Dasgupta, Arpan (Session 38, Talk 8)

A Heterogeneously Integrated, High Resolution and Flexible Inorganic μLED Display using Fan-Out Wafer-Level Packaging
Ezhilarasu, Goutham (Session 15, Talk 3)

Nanowire Impregnated Poly-dimethyl Siloxane for Flexible, Thermally Conductive Fan-Out Wafer-Level Packaging
Irwin, Randall (Session 34, Talk 2)

Demonstration of a Low Latency (<20 ps) Fine-pitch (≤10 μm) Assembly on the Silicon Interconnect Fabric
Jangam, SivaChandra (Session 38, Talk 10)

Deep Trench Capacitors in Silicon Interconnect Fabric
Kalappurakal Thankappan, Kannan (Session 45, Talk 11)

Atomic Layer Deposited Al2O3 Encapsulation for the Silicon Interconnect Fabric
Shakoorzadeh-Chase, Niloofar (Session 27, Talk 6)

Demonstration of Superconducting Interconnects on the Silicon Interconnect Fabric Using Thermocompression Bonding
Yang, Yu-Tao (Session 39, Talk 6)

Why all this hype about Heterogeneous Integration?
Subramanian Iyer (Special Sessions: Future Seminconductor Packages for Artificial Intelligence Hardware)


Special Sessions: HIR Workshop – The Next Phase of Innovation: Heterogeneous Integration