HIR International Roadmap Workshop
Date: Tuesday, May 28, 2019
Time: 8:00 AM - 5:30 PM
Location: The Cosmopolitan, Las Vegas, NV
Room: Condesa 3
Program Sessions: Wednesday, May 29
Session 6: Emerging Flexible Hybrid Electronics
6. 10:50 AM - Heterogeneous Integration of a Fan-Out Wafer-Level Packaging Based Foldable Display on Elastomeric Substrate
Arsalan Alam
Program Sessions: Wednesday, May 29, 2019
Session 12: Advanced Photonic Devices and Packaging
4. 3:30 PM - Integration and Characterization of InP Die on Silicon Interconnect Fabric
Eric Sorensen
Program Sessions: Thursday, May 30
Session 13: Technologies Enabling 3D and Heterogeneous Integration
2. 8:25 AM - Process Development of Power Delivery Through Wafer Vias for Silicon Interconnect Fabric
Meng-Hsiang Liu
Program Sessions: Thursday, May 30
Session 14: Fine Pitch Solder-Free Bonded Interconnects
1. 8:00 AM - Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects Using In-Situ Formic Acid Vapor Treatment
Siva Chandra Jangam
Program Sessions: Thursday, May 30
Session 17: Materials and Design for Reliability of Next Generation Packages
7. 11:15 AM - Reliability studies of Silicon Interconnect Fabric (Si-IF)
Niloofar Shakoorzadeh
Program Sessions: Friday, May 31
Session 32: Power and Panel Assembly
2. 3:30 PM - High Yield Precision Transfer and Assembly of GaN µLEDs Using Laser Assisted Micro Transfer Printing
Goutham Ezhilarasu
Program Sessions: Friday, May 31
Session 35: New Interconnects for Package Scaling
2. 1:55 PM - PowerTherm Attachment Process for Power Delivery and Heat Extraction in the Silicon-Interconnect Fabric
Pranav Ambhore
Interactive Presentations: Friday, May 31
Session 41: Student Interactive Presentations
Time: 8:30 AM – 10:30 AM
On-Chip ESD Monitor
Kannan Kalappurakal Thankappan