UCLA CHIPS Presentations at the 2019 IEEE ECTC and ITHERM May 28, 2019 8:00 AM - May 31, 2019 5:00 PM

9 Paper / Poster Presentations

UCLA CHIPS is pleased to announce 9 papers and posters have been
accepted to the 2019 IEEE ECTC and ITHERM.

HIR International Roadmap Workshop
Date: Tuesday, May 28, 2019
Time: 8:00 AM - 5:30 PM
Location: The Cosmopolitan, Las Vegas, NV
Room: Condesa 3

If you will be attending either conferences, we hope you will be able to
attend our student presentations, listed below.

2019 ECTC Presentations:

Program Sessions: Wednesday, May 29
Session 6: Emerging Flexible Hybrid Electronics
6. 10:50 AM - Heterogeneous Integration of a Fan-Out Wafer-Level Packaging Based Foldable Display on Elastomeric Substrate
Arsalan Alam

Program Sessions: Wednesday, May 29, 2019
Session 12: Advanced Photonic Devices and Packaging
4. 3:30 PM - Integration and Characterization of InP Die on Silicon Interconnect Fabric
Eric Sorensen

Program Sessions: Thursday, May 30
Session 13: Technologies Enabling 3D and Heterogeneous Integration
2. 8:25 AM - Process Development of Power Delivery Through Wafer Vias for Silicon Interconnect Fabric
Meng-Hsiang Liu

Program Sessions: Thursday, May 30
Session 14: Fine Pitch Solder-Free Bonded Interconnects
1. 8:00 AM - Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects Using In-Situ Formic Acid Vapor Treatment
Siva Chandra Jangam

Program Sessions: Thursday, May 30
Session 17: Materials and Design for Reliability of Next Generation Packages
7. 11:15 AM - Reliability studies of Silicon Interconnect Fabric (Si-IF)
Niloofar Shakoorzadeh

Program Sessions: Friday, May 31
Session 32: Power and Panel Assembly
2. 3:30 PM - High Yield Precision Transfer and Assembly of GaN µLEDs Using Laser Assisted Micro Transfer Printing
Goutham Ezhilarasu

Program Sessions: Friday, May 31
Session 35: New Interconnects for Package Scaling
2. 1:55 PM - PowerTherm Attachment Process for Power Delivery and Heat Extraction in the Silicon-Interconnect Fabric
Pranav Ambhore

Interactive Presentations: Friday, May 31
Session 41: Student Interactive Presentations
Time: 8:30 AM – 10:30 AM
On-Chip ESD Monitor
Kannan Kalappurakal Thankappan


2019 ITHERM Presentations:

DAY 2: THURSDAY, MAY 30    5:00 – 7:00 PM 
Poster Session - Rm: Gracia 4/8
Dynamic Thermal Management for Silicon Interconnect Fabric using Flash Cooling (p413) 
Ujash Shah
DAY 3: FRIDAY, MAY 31    4:40 – 5:00 PM 
Dynamic Thermal Management for Silicon Interconnect Fabric using Flash Cooling (p413) 
Ujash Shah