5 Most Popular T-CPMT Articles according to Xplore® usage statistics March 2019

Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration Takafumi Fukushima ; Arsalan Alam ; Amir Hanna ; Siva Chandra Jangam ; Adeel Ahmad Bajwa ; Subramanian S. Iyer Publication Year: 2018, Page(s):1738 - 17463-D Printed Metal-Pipe Rectangular Waveguides Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn Publication Year: 2015, Page(s):1339-1349 An Electrohydrodynamic Jet Printing System With Metal Nanoparticle-Based Ink: Experimental Evaluation Jung Woo Sohn ; Chulhee Han ; Chun-Yong Park ; Seung-Bok Choi Publication Year: 2019, Page(s):343-352 Composite Glass-Silicon Substrates Embedded With Microcomponents for MEMS System Integration Bin Luo ; Mengying Ma ; Ming-Ai Zhang ; Jintang Shang ; Ching-Ping Wong Publication Year: 2019, Page(s):201- 208 Novel Electronic Packaging Method for Functional Electronic Textiles Menglong Li ; John Tudor ; Jingqi Liu ; Russel Torah ; Abiodun Komolafe ; Steve Beeby Publication Year: 2019, Page(s):216-225

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