Date: Tuesday, March 30 / 2:30 – 3:00 PM EDT Session No: Session 7 : Design, Power, and Reliability No: 7.4 Title: Segmented Power Delivery and Thermal Management for Heterogenous Wafer-scale Systems Date: Tuesday, March 30 - Thursday April 1 / 12:00 – 1:00 PM EDT Session No: Poster Session : Packaging, Integration, Thermal & Control Technologies Posters No: P47.2 Title: Reliability Considerations for Wafer Scale Systems No: P47.3 Title: An On-chip ESD Sensor for Dielet-based Heterogeneous Integration No: P47.4 Title: Signal and Power Delivery using Flexible, High-Speed Connectors and Segmented PCBs for System-on-Wafer Applications
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