TSMC R&D Chief: There’s Light at the End of the Chip Shortage

Yuh-Jier Mii started on the ground floor of Taiwan Semiconductor Manufacturing Co. in 1994 as a fabrication integration manager. Today he’s one of the Hsinchu-based company’s leaders as senior vice president of research and development. During his nearly 30 years at TSMC, he has been involved with the creation of denser and denser integrated circuits. The IEEE member is in charge of R&D for new chips built using TSMC’s 3-nanometer process node, expected to go into production later this year. (The commercial term nanometer refers to a new, improved generation of silicon semiconductor chips.) The world’s largest contract chip manufacturer credits Mii with helping it maintain technology leadership in the foundry segment of the global semiconductor industry.