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2017 UCLA CHIPS Workshop Agenda - Wednesday, November 1 , 2017 |
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Time |
Event Description |
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8:30am to 9:30am |
Registration / Breakfast |
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9:30am to 10:00am |
Introduction / Opening Remarks Subramanian Iyer - UCLA Harold Monbouquette - Associate Dean, UCLA |
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Session 1 Chair: Mark Goorsky - UCLA |
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10:00am to 10:30am |
Keynote 1 - "WLSI technologies for Heterogeneous Integration" Chuei-Tang Wang - TSMC |
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10:30am to 11:00am |
Keynote 2 - "Heterogeneous Integration Roadmap – Global Collaboration" William Chen - ASE |
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Panel Discussion Chair: Adeel Bajwa - Postdoctoral Scholar, UCLA ECE |
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11:00am to 12:00pm |
"Heterogeneous Integration Roadmap" Andrew Kang - UCSD Meyya Meyyapan - NASA Ravi Mahajan - Intel Corporation Timothy Lee - Boeing William Chen - ASE Daniel Green - DARPA |
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12:00pm to 1:00pm |
Lunch + Poster Session |
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Session 2 Chair: Puneet Gupta - UCLA |
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1:00pm to 1:30pm |
Keynote 3 - "Semiconductor Outlook: A Connected World and Changes in the Packaging Landscape" Daniel Tracy - SEMI |
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1:30pm to 2:00pm |
Keynote 4 - "DARPA’s Role in Heterogeneous Integration" Daniel Green - DARPA |
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Session 3 Chair: Greg Pottie - UCLA |
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2:00pm to 2:30pm |
Keynote 5 - "Supply Chain Integrity for Heterogeneous Integration" Srinivasa Banna - GlobalFoundries |
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2:30pm to 3:30pm |
CHIPS Report Subramanian Iyer - UCLA |
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Poster Session Chair: Matthew Putman - CEO, Nanotronics |
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3:30pm to 6:00pm |
Poster Session + Social Mixer hosted by Nanotronics |
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Section 1: Heterogeneous Integration Platforms |
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Silicon Interconnect Fabric Technology SivaChandra Jangam - UCLA |
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Deep Silicon Etching for Through Wafer Via (TWV) and Plasma Dicing (PD) on Si Interconnect Fabric Yandong Luo - UCLA |
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Reliability Evaluation of Silicon Interconnect Fabric Technology Kannan K.T. - UCLA |
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Performance Scaling using Packageless Systems on Si-IF Saptadeep Pal - UCLA |
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Effect of Stress Buffer Layers on Buckling Reduction of Cu Interconnects on Elastomeric Substrates Randall Irwin - UCLA |
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Process Optimization for Fine Pitch Interconnects on FlexTrateTM using FOWLP Arsalan Alam - UCLA |
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Section 2: Neuromorphic Computing |
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Deep Learning for Medical Image Segmentation Facilitated by Neuromorphic Hardware Steven Moran - UCLA |
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Neuromorphic Computing Featuring Charge-Trap Transistors as Analog Synapses Xuefeng Gu - UCLA |
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Three-Dimensional Wafer-Scale Integration for Ultra-Large-Scale Neuromorphic Systems Zhe (Frank) Wan - UCLA |
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Spine Segmentation using a Sequence of Convolutional Neural Networks William Whitehead - UCLA |
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Section 3: Power and Thermal Management |
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Power Distribution in Silicon Interconnect Fabric Premsagar Kittur - UCLA |
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Adaptive Power Management for Guardband Reduction in Multicore SoC Designs Samantak Gangopadhyay - Georgia Tech |
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Thermal Conduction and Convection Technologies for Cooling of Advanced Electronics Ujash Shah - UCLA |
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Section 4: Passives and RF Integration |
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High Density Integrated Passives for SuperCHIPS Application Goutham Ezhilarasu - UCLA |
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Low-loss RF Heterogeneous Integration within Si-IF Partia Naghibi - UCLA |
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Overcoming Chu's Limit through Switched Electrically Small Antennas using Direct Antenna Modulation Jean Paul Santos - UCLA |
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Section 5: Radiation Effects and Detection |
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Radiation Effects in Advanced Systems Rachel Brewer - Vanderbilt University |
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Synthesis and Study of ZnO:Ga Films for Application as Scintillator for Radiation Detection Karla Cervantes - Benemerita Universidad Autónoma de Puebla, Puebla, Mexico |
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