7:30 am Registration
8:00 am Welcome
8:10 am Basics: Plasma, Reactors, and Etching Mechanisms
10:15 am Break
10:30 am Dielectric Etching
11:15 am Compound Semiconductor Etching
12:00 pm Networking Lunch
1:00 pm Deep Reactive Ion Etching of Silicon
1:45 pm Plasma Dicing
2:15 pm Endpoint Basics & Thermal Budget Management
3:00 pm Break
3:15 pm PVD, PECVD and HDP CVD (high density plasma CVD)
4:30 pm Conclusion (Note: Q&A will be encouraged during the talks)