ECTC Posters and Presentations
ITherm Posters and Presentations
ECTC CHIPS Papers
"Architecting the Thermal Dissipation and Power Delivery for Chiplet-Based Wafer-Scale Systems and Experimental Demonstration of Segmented Vertical Cooling for Silicon Dielets at 1 W/mm2 Power Density"
Haoxiang Ren
"Demonstration of a Fully Integrated, High Bandwidth, Active Flexible Connector for Large Area Computational Systems"
Randall Irwin
"A High Throughput Low-Temperature Copper-Copper Thermal Compression Bonding Scheme using Tin Overlayer"
Tanmay Konnur
"Through GaN Via for 3D Heterogeneous Strata Integration"
Jui Han Liu
"Reliability Assessment of a Hybrid Wiring Layer Assembly for Low-Cost Sub 10 μm Pitch Integration"
Vineeth Harish
"Integrated Passive Devices in the Silicon Interconnect Fabric"
Haoxiang Ren
"FlexPower II: Flexible Interdigitated Battlet Li-ion Battery on FlexTrateTM for Wearables"
Mansi Sunil Sheth
"3D Heterogeneous Integration of Packaged Dies for Flexible FOWLP Micro-Display Using Low-Temperature Solder Bonding on FlexTrateTM"
Henry Sun
"Enabling 10 μm Die-to-Die Pad Pitch in Flexible Fan-Out with TrueAdaptTM"
Golam Sabbir
ITherm CHIPS Papers
"Flash Cooling With Methanol/Water Mixtures for 1 W/mm2 Fluxes Without Lateral Heat Spreading"
Naarendharan Meenakshi Sundaram
"Flash Boiling of Methanol/Water Mixtures in a Microchannel Cooler"
Naarendharan Meenakshi Sundaram